Optimized Performance is what our customers experience when they receive a DSL Cantilever probe card. Specializing in high density, fine pitch, multi-die and Shelf Style technology, DSL Lab's epoxy line provides a product delivered in fast turn times, adheres to strict quality guidelines, and provides substantial savings over the life of the probe card.

Combined with years of experience, backed by DSL Lab's API-VX3 analyzer, custom automated drill and vision systems, our engineering staff is able to provide support in testing varied semiconductor device types from standard single die to multi-die configurations and more.

Standard Cantilever Specifications

• Probe counts: > 500 probes and higher
• Probe Layers: > 6 layers
• Operating Temperature: - 45 C to 200 C
• Probe Materials: Rhenium Tungsten, Hardened Beryllium Copper and Paliney
• Probe (wire) Diameter: 4 to 15 mils
• Probe Tip Diameter: 0.6 mils to 2 mils
• Pad Pitch: < 50 um
• Overdrive (OD): 2 mils
• Alignment and planarity: +/- 0.35 mils (+/-8.90um)
• Leakage: 10nA at 5V
• Contact Resistance: 2Ω
• Current: < 400 mA 'steady' state condition for 1.0 mil RW tip diam.