DSL offers Buckling Beam Style Vertical Probe Cards. Vertical Probe Cards were developed to satisfy the requirements of probing C-4 (Controlled Collapse Chip Connection) Flip Chip devices. Vertical Probe Cards are the ideal solution for testing Area Array Microprocessors, DSP's and other advanced logic/ASIC devices that are bumped for flip-chip (C4) applications. Offering a variety of probe sizes, probe materials, and tip geometries,DSL Lab's vertical probe card is designed to solve your difficulties probing multiple IC's and Area Array Solder Bumps.

Vertical Capability

• Pad Pitch: 150 µm
  
• Probe Diameters: 3 and 4 mil
  
• Probe Material: Paliney7, BeCu Alloy 25
  
• Probe Tip Style: Flat, Pointed
  
• Probe Length: 165 and 220 mils
  
• Array Size: >25 X 25mm
  
• Planarity: < 25 µm
  
• Maximum OT: 125 and 200µm
  
• I/O Count: >1,024
  
• Probes 7,000
  
• Signal Path Resistance: 8 Ω single channel
  
• Power Path Resistance: 3 Ω single Power Supply Channel
  
• Contact Force: 2.5-3.0 grams/mil
  
• Current Carrying: 500 ma @ 35° C Theoretical (P7)
  
• Probe Alignment: 25 µm maximum radial