Burn-in Specifications

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Qualifications / Reliability

Qualification and reliability tests ensure proper IC design, package assembly and its integrity by performing electrical stress, thermal stress and mechanical stress tests to identify the occurrence of failures and their severity. DSL Labs' experienced Product Engineers can create a qualification plan for each product's requirements or perform testing to out customers' requirements. Understanding the scope of industry testing standards such as JEDEC, MIL 883, and EIAJ, DSL Labs insures proper compliance where applicable, and also to individual customer's specification

General Burn-in Specifications

Burn-in Specifications
MICRO CONTROL BURN-IN SYSTEMS	- High Power Burn-in Specifications
Temperature control per DUT up to 150 Watts Programmable temperature control up to 150 C Up to 128 digital I/O channels per driver/reciever 11 programmable Voltage regulators	1600 Amps of DUT power available System capacity up to 384 Devices ASIC architecture for per-pin timing, testing and formatting of pattern 8 on-the-fly timing sets
AEHR MAX III BURN-IN SYSTEMS	- Dynamic Burn-In Specifications
Stimulus voltages as low as 0.8V with 40A per slot Limited Output Monitoriing Capability 2 Meg depth pattern	96 channels programmable vectors Configurable with up to 11 independant pattern zones Excercising with patterns with JTAG and BSTT
CRITERIA BURN-IN SYSTEMS	- Standard Static & Dynamic Burn-In Specifications
Temperature range from ambient to 160C Airflow range from 1200 CFM to 1600 CFM DC Power Voltage 1V to 20V +/- 10% Current up to 50 Amps per board using high current power clips	up to 72 boards per system Incal Clock Drivers Levels : Vih 1V to 7V +/- 10% 96 channels programmable vectors Up to 4 Meg depth pattern (standard is 1 Meg)