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Device Level Failure Analysis
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Device Level Failure Analysis entails the evaluation of microelectronic devices and integrated circuits or circuit
boards/units that may have failed during design, manufacture, qualification, or in the field.
Level 1 Analysis:
- External device inspection
- I/V Characterization (curve tracer) to verify failure
- X-ray inspection
- Scanning Acoustic Microscopy
- Chemical or Mechanical De-capsulation
- Optical microscopic Examination
Level 2 Analysis:
- System (Board/Module) Level Analysis
- Analytical Probing: Die, package or PCB
- Bench test
- Package/Die fault isolation
- Thermal Imaging Microscopy (IR) localization (Backside/Front side)
- Photo Emission Microscopy (Backside/Front side)
- XIVA Leakage/Fault Isolation (Backside/Front side)
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Level 3 Analysis:
- Mechanical/Chemical deprocessing
- Precision cross sectioning
- Parallel Polishing/Delayering
- Plasma Delayering (RIE/ICP)
- Wet Chemical Delayering
- Focused Ion Beam (FIB) in conjunction with fault isolation
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