DSL Labs, Inc. can provide the following cross sectioning techniques:

• Cleaved sections
• Mechanical sections
• FIB prepared sections

A hand cleave section is performed by breaking a wafer along it's crystallographic plane. The technique is quick and produces a relatively good surface for photography. The disadvantage is that it is difficult to control the break plane and therefore much tougher to section a specific site.

A mechanical section is accomplished by grinding and polishing an IC, PCB, or other device to the region of interest. Typically, this technique gives the best image quality for high resolution SEM imaging.

The FIB section is completed using a focused ion beam to cut a profile into a specific site of interest. The technique can produce precise and repeatable sections.