Qualification and reliability tests ensure proper IC design, package assembly and its integrity by performing electrical stress, thermal stress and mechanical stress tests to identify the occurrence of failures and their severity. DSL Labs' experienced Product Engineers can create a qualification plan for each product requirements or perform testing to our customers' requirements. Understanding the scope of industry testing standards such as JEDEC, MIL 883, and EIAJ, DSL Labs insures proper compliance where applicable, and also to individual customer's specification

DSL Labs can also assess the long term reliability of IC's, their suitability of use, their interaction in sub-systems, field use, and storage conditions. Our Reliability Engineering experts can work diligently with our customer's subcontractors (foundry sources, assembly sources, etc.) to identify the root causes of failures which help our customers take further steps to improve and enhance the reliability of their products.

Features

• HTOL; Standard dynamic and static, and also Testing and Monitored Burn-in using state of the art MCC HPB5A and HPB5B systems
• Aehr Max III, IV Systems
• Temperature & Humidity Bias (THB or 85/85) HAST; Biased and unbiased
• C-SAM
• Pre-Conditioning
• I/R (solder) Reflow
• Temperature Cycling (tri-zone temp.)
• HAST; biased and unbiased
• High-Temperature Storage
• Moisture Sensitivity Level Testing
• Solderability
• Autoclave
• ESD & Latch-Up KeyTek Zapmaster MK.4